Anil Krishnamurthy Hardware Engineer
Santa Clara, CA • hwengineer@gmail.com • +1 408-555-0169
Profile Summary
- Hardware Engineer with 10 years of experience designing server-class compute boards across data-center compute, networking, and high-speed I/O, specializing in multi-layer PCB design, high-speed signal integrity, and DFM-first design reviews.
- Solid technical background across EDA suites (Altium Designer, Cadence Allegro), simulation (LTspice, Cadence Sigrity), silicon (NXP i.MX, AMD Xilinx), high-speed buses (PCIe Gen4, DDR4), and compliance standards (FCC Part 15, CE / CISPR 22), with strong fundamentals in signal-integrity discipline, DFM-first thinking, and rigorous design-review process on every spin.
- Deep expertise in mixed-signal circuit design, multi-layer PCB layout and high-speed routing, signal and power integrity engineering, and prototype bring-up and validation, applying practices such as DFM-first design reviews and lab-to-fab discipline to deliver manufacturable, certifiable, and reliable hardware.
- Engaged collaborator working cross-functionally with Firmware, Mechanical, Test, and Operations leadership in phase-gated hardware programs, contributing to schematic + layout review boards, EVT / DVT / PVT campaigns, and post-spin retrospectives with a pragmatic, ownership-first mindset.
- Senior engineer who shares technical excellence and fosters a culture of design-review rigor and written ECO discipline through schematic-review coaching and lab-bench mentorship, while running hardware design-review board sessions and authoring widely adopted schematic-template and design-checklist libraries.
Technical Skills
- EDA & Schematic Capture:
- Altium Designer, Cadence Allegro / OrCAD, Mentor Xpedition, KiCad, ECAD library management, multi-sheet schematics
- PCB Layout & DFM:
- Multi-layer stack-up (4-16 layer), high-speed routing, impedance control, DFM / DFT, IPC-2221 / IPC-7351
- Simulation & Modeling:
- LTspice, Cadence PSpice, Cadence Sigrity (SI / PI), ANSYS HFSS, Keysight ADS, thermal sims (Icepak)
- SI / PI & EMC:
- DDR / PCIe / Ethernet SI, power-delivery networks, decoupling, FCC Part 15, CE / CISPR 22, pre-compliance scans
- Lab Test & Validation:
- Oscilloscopes (Tektronix MSO, Keysight Infiniium), logic analyzers, VNA, spectrum analyzers, thermal chambers, PVT characterization
- Components & BOM:
- Component selection, lifecycle / EOL management, alternates strategy, supply-chain risk, Octopart / Arrow / Avnet sourcing
- Firmware Interface & Co-Design:
- Register-map definition, GPIO / peripheral planning, boot sequencing, JTAG / SWD debug, board bring-up support, FPGA bring-up
- Manufacturing, Compliance & Lifecycle:
- DFM / DFT, ICT / JTAG / boundary scan, NPI support, UL, IEC 62368, FCC, CE, RoHS / REACH, ECOs, design reviews
Education
Work Experience
- Own schematic and circuit design for the server-class compute reference board across 5 board variants over 7 spins, coordinating schematic capture and circuit design, multi-layer PCB layout review, and lab bring-up and validation with influence across 40+ engineers across 6 IPTs.
- Drove PCB layout reviews on a 14-layer stack-up with impedance-controlled high-speed routing up to 16 GT/s PCIe Gen4, shipping zero DFM holds at fab across the program.
- Selected and qualified 240 active components with 38 second-source alternates against lifecycle and supply-chain risk, delivering a 14% cost reduction on the BOM during one of the silicon shortages.
- Led prototype bring-up across 7 EVT / DVT spins using staged power-rail bring-up, JTAG and boundary-scan validation, and scope-probe debugging, hitting first-pass success on 6 of 7 builds.
- Characterized board performance on Keysight Infiniium + Tektronix MSO benches, sweeping all 27 PVT corners across temperature, voltage, and process variation with zero hardware escapes to field over 3 production cycles.
- Closed timing on PCIe Gen4 + DDR4-3200 with 22% eye-margin headroom via SI / PI co-simulation in Sigrity, refined decoupling networks, and pre-layout topology planning, securing first-pass FCC Part 15 + CE compliance at the cert lab.
- Partnered with firmware on hardware-software co-design: defined 320+ register fields, planned 18 GPIO and I2C peripherals, and sequenced boot rails so the board reached boot-to-OS on first build with no hardware rework.
- Owned DFM / DFT on automotive ECU programs using JTAG boundary-scan test coverage, ICT-fixture design, and partner-CM co-engineering, supporting 6 NPI launches and lifting PVT yield from 78% to 96% PVT yield across the line.
- Drove regulatory compliance and certification against UL 60950 + IEC 62368, FCC Part 15, and CE / CISPR 22, cleared 4 products through global cert and shepherding 11 third-party lab audits without a single test re-spin.
- Authored 70+ ECOs over 4 years with rigorous rationale, traceability, and reviewer sign-offs, closing zero unresolved review items at TC on the programs I shepherded.
- Partnered with Firmware, Mechanical, Test, and Operations teams across 4 automotive ECU programs, authoring 22 schematic + layout review packs that became the team's design-review reference and onboarding 5 new hardware engineers into the team's lab-bench and review-board workflow.