ASIC Engineer Resume: Complete 2026 Guide

From the author

Emmanuel Gendre, ex-Google recruiter

My experience with ASIC Engineer resumes

Twelve years in tech recruiting, including a long stretch at Google, and the ASIC Engineer resume has a familiar failure mode: it lands as an EDA tool inventory. Innovus, ICC2, PrimeTime, Genus, Calibre, Virtuoso, a list of process nodes, all stacked on the page without a real chip holding them together. The actual work is messier and far more interesting: a hold-time violation on a critical path that synthesis couldn't close until you re-pipelined the register file by hand, a UPF power-gating sequence that crashed at silicon bring-up because the retention flops were buggy, a 7nm IR-drop hotspot that forced a power-grid re-spin two weeks before tape-out, a DRC-clean run that finally went green at 11pm on signoff day. None of that lands when the resume reads as a tool list.

What hiring teams actually want in 2026 is the chip behind the EDA flow. An ASIC Engineer resume reading as "Innovus, ICC2, PrimeTime" without a timing closure on advanced nodes, a power-grid you defended at signoff, or a silicon tape-out you shipped to first-pass success gets dropped before any conversation happens.

That gap is exactly what this guide closes. Five sections decide whether the ASIC Engineer screen even starts, and the rest of this guide goes through them one at a time. The single goal: interviews back on the calendar, regardless of how soft the market feels right now.

Want the rewrite done for you? My Tech Resume Writing Service rebuilds the page from a blank file. Already have a draft and just want trained recruiter eyes on it? Drop it into the free review; every one passes through me directly and the notes come back from me.

Time to get your ASIC Engineer resume opening calls instead of getting filtered. Let's start.

What the ASIC Engineer resume guide covers

How I rewrite an ASIC Engineer resume

An ASIC engineer draft hits my inbox most weeks, between the resume writing service and the free reviews. The pattern repeats: about ninety percent of the page is wasted real estate, and only five sections decide whether the screen closes. Doing it on your own? Spend the time on those five and skip the rest.

Below, each one has its own dedicated walkthrough. Hit them top to bottom, apply each change as you go, and the version you ship feels nothing like the one you started with. Here is the layout:

Want the method behind it? Here's how I rewrite resumes, laid out in full.

Step 1 · ASIC Engineer Resume Format

The format to use for an
ASIC Engineer resume

Knock this one out first: the ATS has to be able to ingest the page.

Most online advice on layouts is noise. The work boils down to one thing: a text parser has to pick up your content and structure exactly as you wrote them, with nothing dropped along the way.

Keywords matter for filtering further down the funnel (that's Technical Skills, Step 5), but parsing failures are what eliminate 95% of resumes before anyone reads a word.

Three short rules cover most of it:

Use a text editor (Word, Google Docs)

The ATS layer reads text and nothing more. If the file is not actually text on the page, the parser returns an empty bucket. Lay your resume out in Canva or Illustrator and every character turns into a flat pixel image, so the EDA tools and process nodes you carefully curated quietly disappear. To the parser, you handed in a blank sheet.

Single column, plain layout

Pull every column, sidebar, table, and image out of the layout. ATS engines in 2026 still chew them up, and this is the single most common parsing failure I catch in reviews (about three drafts in ten land here). Switch to a clean single-column layout and most of the parsing damage corrects itself.

Simple section titles

Use Profile Summary, Technical Skills, Work Experience, Education. Not "Chips I've Taped Out", not "What I Bring to Silicon". ATS and recruiters both look for standard headings, and a clever label just drops you out of the bucket. Avoid fuzzy ones too: "Core Competencies" lives inside Profile Summary or Technical Skills; "Career Highlights" lives inside Profile Summary or Work Experience.

Unsure how your current PDF holds up under parsing? Run it through the ATS resume checker and look at the extracted output side by side with the page. When the extracted version comes out broken, the bullets aren't the problem, the layout is, and layout is most of how an ATS scores you.

Want a clean slate that parses correctly out of the box? Grab the ASIC Engineer resume template, designed for exactly that.

Step 2 · ASIC Engineer Profile Summary

Writing a profile summary
for an ASIC Engineer

Whatever you've read elsewhere, no resume should skip the Profile Summary. Juniors included.

If yours is missing, or it's there but weak, fixing it is the biggest single win on the table today.

Full mechanics live inside how recruiters screen resumes. In short: every resume gets two passes from a recruiter. The first pass shrinks the pile down to anyone reading as plausible for the role. The second pass compresses that group into the final interview list.

The first pass is the harsh one: a recruiter blasts through file after file in succession, spending only seconds per file. That's where the famous "10-second screen" number originates.

The Profile Summary is your only opportunity to land every cue a recruiter looks for inside that tight window. Stick it and the rest of the page gets opened; whiff it and nothing else carries weight.

Every bullet has a defined role. Below is the playbook I use when rewriting a hardware engineer profile summary: what each line is on the hook for, plus a worked example tied to a real product.

Target job title, overall experience & product scope

Bullet 1 sets the marker: the role you're aiming at, your seniority, plus the process node and chip class (TSMC 7nm / 5nm / 3nm, Samsung 4LPP, Intel 18A; chip type like AI accelerator, mobile SoC, networking chip, automotive SoC). Add a domain (mobile, automotive, AI/ML, networking) and a recognized employer if either lifts weight. Read this sentence as the page's top headline: a recruiter clocks it before anything else, and on rushed days it is sometimes the only line they reach.

Info for recruiters Target job title Years of experience Process node & chip class Domain & foundry

Example Senior ASIC Engineer 10 years AI inference accelerator on TSMC 7nm Three tape-outs, first-silicon success

Domain expertise

Bullet 2 covers your domain expertise: the slots that make up the ASIC Engineer role profile (laid out in Step 3, ASIC Engineer Work Experience). For this role those slots are RTL design and micro-architecture, synthesis and logic optimization, physical design, static timing analysis, and verification. A non-technical screener walks that scorecard line by line and ticks off your entries. Treat this bullet as your own scorecard and leave no row empty.

Info for recruiters RTL & micro-architecture Synthesis (Genus / DC) Physical design (Innovus / ICC2) STA (PrimeTime / Tempus) UVM verification

Example Systolic-array MAC (350M gates) Multi-Vt cell, low-power UPF flow Hierarchical PD on 7nm Signoff timing at 1.2 GHz UVM with 96% functional coverage

Your tech stack

Bullet 3 names your daily stack: the HDL, the synthesis tool, the P&R flow, the STA signoff tool, and the process node you tape out to. The full inventory lands further down under "Technical Skills" (covered in Step 5, ASIC Engineer Technical Skills); up here you only call out the daily drivers. For an ASIC Engineer that means: HDL, synthesis, P&R, STA, and process node.

Info for recruiters HDL Synthesis Physical design STA signoff Process node

Example SystemVerilog, SVA Cadence Genus, Synopsys DC Cadence Innovus, Synopsys ICC2 PrimeTime, Tempus signoff TSMC 7nm / 5nm

Collaboration

Bullet 4 covers your cross-functional partnership. ASIC design sits between architects (who set PPA targets), RTL designers (your peers), verification engineers (UVM and formal), physical design and CAD teams (running flows on your blocks), package and board engineers (who deal with your bumps and I/O), and the foundry interface (DRC, LVS, tape-out coordination). A hiring manager checks whether you carry those handoffs cleanly, so name the partner teams and the interfaces you owned.

Info for recruiters Partner teams Foundry / DRC-LVS interface Package / board handoff

Example Architecture & PPA owners RTL & Verification CAD & Physical Design Package & Board Foundry interface

Leadership

Bullet 5 surfaces your technical leadership. Even pure-IC electrical engineers have a line worth showing here. Leadership shows up in the converter patterns and the discipline: chairing power-stage and control-loop design reviews, authoring the functional-safety case the team works against, owning the gate-driver and magnetics library, and coaching junior ASIC engineers through their first power bring-up.

Info for recruiters Methodology you author Engineers you mentor Signoff reviews you chair

Example Timing & power methodology owner Standard-cell library lead Signoff & tape-out review chair

ASIC Engineer Profile Summary Example

Senior, AI inference accelerator on TSMC 7nm

Profile Summary

Senior ASIC Engineer with 10 years shipping AI inference accelerators on TSMC 7nm with hierarchical physical design, three tape-outs to first-silicon success.
Strong on RTL Design & Micro-architecture, Synthesis & Logic Optimization, Physical Design (Place & Route), Static Timing Analysis, and UVM Verification.
Day-to-day across HDL (SystemVerilog, SVA), Synthesis (Cadence Genus, Synopsys DC), P&R (Cadence Innovus, Synopsys ICC2), STA (PrimeTime, Tempus), and Signoff (Calibre DRC/LVS, IR-drop analysis).
Cross-functional partner across Architecture, RTL/Verification, CAD/Physical Design, and Foundry interface, owning a 350M-gate hierarchical block partition that closed signoff timing at 1.2 GHz on first silicon.
Authors the timing and power methodology, chairs signoff and tape-out reviews, owns the standard-cell library and constraints flow, and coaches junior ASIC engineers through their first signoff.

Want to go deeper on this one? I cover it end to end in my guide on how to write a killer profile summary.

Want a recruiter's read on your ASIC engineer resume?

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Let me pull it apart for you.

I'll run a simulated recruiter screen on your ASIC Engineer resume and send back a tight list of what to fix. Free, within 12 hours.

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Step 3 · ASIC Engineer Work Experience

Work experience on an
ASIC Engineer resume

Now back into round two. This is the section that determines whether you get the call at all, and a recruiter actually slows down here. Even so, 95% of the decision still comes from your most recent role.

The logic is simple. Your current job is the truest signal of how you operate today, what you actually run hands-on, and where your seniority genuinely sits. To turn the screen toward an interview, that role has to cover every line in the full ASIC Engineer role profile, one bullet per area you already named in the Profile Summary's Domain Expertise block.

RTL Design & Micro-architecture

This is your ability to shape the micro-architecture behind the RTL: pipeline depth, block partitioning, and the PPA trade-offs each one locks in. On an ASIC those choices set the area and power you're stuck with for the life of the chip, so hiring managers want the decisions you actually owned. Talk about how you used pipeline-depth budgeting and clean block partitioning, kept lint-clean in Spyglass, to hit your gate-count and PPA targets.

Engineering Techniques Pipeline depth & PPA budgeting Hierarchical block partitioning CDC handshakes & metastability Reset / clock architecture

Tools SystemVerilog (IEEE 1800) VHDL-2008 Spyglass Lint, Conformal-LEC

Metrics Gate count & area Lint-clean RTL PPA targets met

Synthesis & Logic Optimization

That's your job in synthesis: turning RTL into gates that hit frequency and area across every corner. The synthesis flow is where PPA is won or lost, so hiring managers want proof you drove it, not that you "ran Design Compiler". Show them how you used disciplined SDC constraints and multi-Vt cell selection, in Genus or Design Compiler, to push post-synth fMax while holding cell area.

Engineering Techniques SDC constraints discipline Multi-Vt cell selection Retiming, ungrouping, boundary opt DFT-aware synthesis

Tools Cadence Genus Synopsys Design Compiler Tcl + SDC constraint flows

Metrics Post-synth fMax Cell area (mm²) Synth runtime & memory

Physical Design & Place-and-Route

Placing and routing millions of gates into a block that closes on an advanced node: floorplan, clock tree, congestion. Area and congestion are hard numbers on a real node, so a block you closed at target carries far more than "did P&R". Point out how you used hierarchical floorplanning and clock-tree synthesis, in Innovus or ICC2, to close a congested block at its target area.

Engineering Techniques Hierarchical floorplanning Clock-tree synthesis (CTS) Congestion & routing closure Useful skew, OCV margining

Tools Cadence Innovus Implementation Synopsys IC Compiler II (ICC2) Synopsys Fusion Compiler

Metrics Block area (mm²) at target Routing congestion (%) P&R turnaround time

Static Timing Analysis & Timing Closure

That's what it takes to sign off timing the foundry will actually see: every corner, setup and hold, no exceptions. Two things ride on it for a hiring manager: hold-time margin and multicorner signoff, since a miss on either shows up as dead silicon. Mention how you used multi-corner analysis and targeted ECO loops, in PrimeTime, to sign off fMax and clear WNS and hold margin across corners.

Engineering Techniques Multi-corner / multi-mode (MCMM) Hold-time & setup analysis ECO loops, late-stage fixes OCV / AOCV / POCV margining

Tools Synopsys PrimeTime Cadence Tempus PrimeTime SI (crosstalk)

Metrics Signoff fMax (GHz) WNS / TNS (ps / ns) Hold margin worst path

Verification (UVM / Formal / Emulation)

This comes down to catching every bug before tape-out, because you don't get to re-flash an ASIC when it's wrong. Hiring managers read verification as the thing standing between you and a multimillion-dollar respin, not "ran some testbenches". Walk them through how you used a UVM environment and an emulation campaign on Palladium, to hit coverage closure and catch a corner-case bug days before signoff.

Engineering Techniques UVM testbench architecture Constrained-random + coverage Formal property verification Emulation & FPGA prototyping

Tools Synopsys VCS / Verdi Cadence Xcelium, JasperGold Palladium, Veloce, ZeBu

Metrics Functional coverage % Bugs caught pre-tape-out Regression turnaround

Design for Test (DFT, Scan, ATPG)

How you make the chip testable once it's silicon: scan chains, ATPG, and memory BIST built in from the start. Test coverage decides whether bad die get caught at the tester, so owning DFT tells a hiring manager you think all the way to the fab. Lay out how you used scan insertion and ATPG, run in TestMAX or Tessent, to hit your stuck-at coverage target without blowing up test time.

Engineering Techniques Scan chain insertion & balancing ATPG (stuck-at, transition) MBIST & BISR for memories JTAG / IEEE 1149.1 boundary scan

Tools Synopsys TetraMAX / TestMAX Mentor Tessent (Siemens EDA) Cadence Modus

Metrics Stuck-at coverage (%) Transition fault coverage Test pattern count / runtime

Power, Clock & Reset Architecture

This is what keeps the chip inside its power and IR-drop budget: the power intent, the clock tree, the reset scheme. Hiring managers look here to see whether the chip meets its power budget, or whether IR drop browns out a corner and the part fails in the field. Spell out how you used a UPF power-intent flow and clock-gating, checked in RedHawk or Voltus, to cut dynamic power and hold IR drop within budget.

Engineering Techniques UPF / CPF power intent Multi-voltage island design Clock-gating & power-gating Retention flops, isolation cells

Tools Synopsys PrimePower, RedHawk Cadence Voltus IR-drop Conformal Low Power

Metrics Dynamic power (mW) Leakage power IR drop worst node (mV)

Tape-out, DRC/LVS & Silicon Bring-up

Can you drive a clean tape-out and bring the chip up in the lab when first silicon lands? Companies hire ASIC engineers who can carry a design through signoff to working silicon, not the ones who hand off before the hard part, so hiring managers look for it. Tell them how you used Calibre DRC/LVS signoff and a disciplined tape-out checklist, into a foundry PDK, to hand off clean GDSII and hit first-silicon success.

Engineering Techniques DRC / LVS signoff Antenna, ERC, fill insertion GDSII tape-out checklist Silicon debug & characterization

Tools Mentor Calibre nmDRC / nmLVS Synopsys IC Validator Foundry PDKs (TSMC, Samsung, Intel)

Metrics First-silicon yield Bring-up time per chip Field defect rate (ppm)

With every slot above filled in, the latest role naturally runs nine or ten bullets long. That is the correct depth, not excess, despite what the "keep it to one sheet" voices on LinkedIn keep pushing. Pages aren't how a recruiter grades you; two dense pages of substance beat a thin single sheet every time. What actually loses the screen is filler, lines occupying space without delivering anything, and stripping filler is exactly what the next section handles.

Step 4 · ASIC Engineer Bullet Points

Bullet points for an
ASIC Engineer resume

On any rewrite, the bullet section consumes the largest share of my hours. The disciplined method I built to handle it, the Level System, came out of that work and now runs across every guide on the site.

The underlying base isn't fictional: it builds on Google's XYZ formula, then pushes further for power-electronics specificity. The mechanics in full live at how to write resume bullet points.

Best way in: pick any ordinary ASIC bullet and stack it back up one layer at a time. The framework is 5 questions, and every answer adds the next dimension of engineering depth to the line.

Walking through them in order drives the bullet out of generic description and into the micro-architecture, PPA, and signoff specifics that hiring managers actually evaluate when picking the ASIC interview shortlist.

1 Task “What did I work on?” What you did
2 + Engineering Techniques “How did I do it?” How you did it
3 + Tools “What tools did I use?” Frameworks, data stores, infra
4 + Method “What method did I follow?” Named methodology
5 + Metric “What was the result?” Quantified impact

Level 1, Just the task. Pick one specific thing you actually built or owned. This is the base layer, not the final line. Plenty of ASIC engineer resumes never move past it, and that's a big reason so many get filtered before a screening call.

Level 1
Just the task

Designed a systolic-array MAC engine for an AI inference accelerator.
Level 2, Add the techniques. Name the specific engineering practices the work used: the testing types, rendering modes, scaling tactics, design patterns. This is where the bullet starts proving you understand how the work was done, not just that it shipped.

Level 2
+ Engineering Techniques

Designed a systolic-array MAC engine for an AI inference accelerator using pipelined int8 multipliers and weight-stationary dataflow.
Level 3, Add the tools. Drop in the named products and versions you used: the framework, the database, the build tool. Recruiters search resumes with technology queries, so the bullet stays invisible without the named stack.

Level 3
+ Tools

Designed a systolic-array MAC engine for an AI inference accelerator using pipelined int8 multipliers and weight-stationary dataflow in SystemVerilog on TSMC 7nm with Cadence Innovus.
Level 4, Add the method. Name the methodology, framework, or design pattern that guided the work: TDD, DDD, BDD, GitOps, MVVM, CQRS, progressive enhancement, and so on. The hiring manager is usually the one enforcing the methodology on the team, so naming yours shows you fit how they actually operate.

Level 4
+ Method

Adopted hierarchical physical design methodology to design a systolic-array MAC engine for an AI inference accelerator using pipelined int8 multipliers and weight-stationary dataflow in SystemVerilog on TSMC 7nm with Cadence Innovus.
Level 5, Add the metric. A number is what lifts a bullet into the top 1%. It pulls double weight: it shows the impact was real, and it shows you measured it on purpose. Skip the number and the line reads identical to every other candidate's.

Level 5
+ Metric

Adopted hierarchical physical design methodology to design a systolic-array MAC engine for an AI inference accelerator using pipelined int8 multipliers and weight-stationary dataflow in SystemVerilog on TSMC 7nm with Cadence Innovus, closing timing at 1.2 GHz on first silicon.

For the full walkthrough, including the trick I use to extract numbers from work that looked unmeasured, see writing resume bullet points. Most ASIC engineers already have the data: signoff fMax, WNS / TNS at sign-off corners, gate count and area in mm², dynamic and leakage power in mW, IR-drop worst node, stuck-at coverage percentage, first-silicon yield. It just never made it onto the page.

Step 5 · ASIC Engineer Technical Skills

Technical skills for an ASIC Engineer resume

The ATS parses your Technical Skills section, and some systems use it for keyword filtering. That's why it needs to echo the language on the job description you're targeting.

By now, though, we're down to the fine details. Nailing this section gives you a nudge through filtering and screening, but the real weight is carried by your Profile Summary, Work Experience, and Bullet Points.

Still, the skills and keywords accumulate over the whole resume, so it pays to know what an ATS and a recruiter both watch for. That's why a separate page exists covering every ASIC engineer skill that matters, technical and soft, with a built-in keyword parser that tunes it to a specific posting.

HDL & Verification

SystemVerilog (IEEE 1800) VHDL-2008 UVM (IEEE 1800.2) SystemVerilog Assertions (SVA) Synopsys VCS / Verdi Cadence Xcelium JasperGold formal Palladium, Veloce emulation
Synthesis & STA

Cadence Genus Synopsys Design Compiler Synopsys Fusion Compiler Synopsys PrimeTime Cadence Tempus PrimeTime SI (crosstalk) SDC / MCMM constraints Multi-Vt cell libraries
Physical Design & Signoff

Cadence Innovus Implementation Synopsys IC Compiler II Hierarchical floorplanning Clock-tree synthesis (CTS) Mentor Calibre nmDRC / nmLVS Synopsys IC Validator RedHawk IR-drop / EM Cadence Voltus power signoff
Custom, Analog & DFT

Cadence Virtuoso schematic Spectre / FineSim analog sim Mentor Calibre xRC extraction Synopsys HSPICE Synopsys TetraMAX / TestMAX Mentor Tessent (Siemens EDA) MBIST / BISR memory test Boundary scan (IEEE 1149.1)
Process Nodes & Domain

TSMC 28nm / 16nm / 7nm / 5nm / 3nm Samsung 8LPP / 4LPP Intel Foundry 18A GlobalFoundries 22FDX Low-power UPF / CPF flow AEC-Q100 automotive grade AI / ML accelerators Mobile SoC, networking, GPU IP

Stop guessing. Ask a recruiter directly.

You now have the format, the profile summary template, the role profile, the bullet system, and the skills categories. All that's left between your draft and the interview is a set of eyes that screened thousands of ASIC engineer resumes telling you what to fix.

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Frequently asked

ASIC Engineer resume FAQ

How long should an ASIC Engineer resume be?

Maps to the number of tape-outs and process nodes behind you. Below 8 years, a single page usually fits. At senior or principal, with several silicon tape-outs across nodes (28nm, 16nm, 7nm, 5nm), a published methodology, and qualifications like AEC-Q100 on your name, two or three pages is the correct call. The "one-page rule" from generic career advice doesn't apply to ASIC work. Padding hurts, but so does compressing a 15-year tape-out portfolio into a single sheet. My tech resume length framework grows with seniority instead of locking to a page total.

Should it be one page?

Not by default. The real question is content density. Early ASIC engineers fit on one page because there isn't a multi-tape-out portfolio yet. At senior or principal, with several chips through tape-out, a timing closure story at hard fMax on advanced nodes, and silicon bring-up stories from the bench, forcing it onto one page deletes the exact evidence that would open the screening call.

What is the most important section?

Your most recent chip, hands down. Roughly 95% of the screening conversation comes from that one role, because hiring teams open it first to check the process node (7nm, 5nm, 3nm), the chip class (SoC, GPU, AI accelerator, networking), the design size (gate count, area, power), and the foundry. The profile summary is second only because it sits above and gets read on the way down.

How do I get my resume past ATS?

Keep it single-column: drop the header icons, sidebars, and images, use plain section titles (Profile Summary, Technical Skills, Work Experience, Education), and export to PDF instead of DOCX. Then run it through my free ATS parser tool and check it's pulling out the HDL, the EDA tools, and the process node. If "SystemVerilog" or "Innovus" or "TSMC 7nm" vanishes from the output, the layout is what's broken, not the content.

What keywords should I include?

For 2026, the ones you can't skip are an HDL (SystemVerilog or VHDL), a synthesis tool (Cadence Genus or Synopsys Design Compiler), a P&R tool (Innovus or ICC2), an STA tool (PrimeTime or Tempus), and a process node (TSMC 7nm / 5nm / 3nm, Samsung, Intel Foundry). Strong supporting keywords are UVM verification, formal property checking, low-power UPF, multi-Vt cells, scan-based DFT, ATPG, and Calibre DRC/LVS. Senior candidates add domain terms like hierarchical physical design, signoff timing on advanced nodes, IR-drop analysis, and AEC-Q100 automotive qualification where relevant. The full list of ASIC Engineer resume skills, ranked by demand, includes a bullet example for each.

Do I need a GitHub or portfolio link?

Different rules than software. ASIC work sits inside heavily proprietary tape-out programs and almost never leaves the company. Public HDL on GitHub helps only when the repo is genuine (a verified open-source IP block, a working RISC-V core extension, a published verification template), never toy projects. Conference papers (DAC, DVCon, ISSCC, VLSI Symposium) and IEEE JSSC publications carry real weight. For senior and principal, the shipped tape-outs carry the proof, so LinkedIn plus a one-paragraph chip summary per role covers it. A repo of half-finished toy designs hurts more than skipping the link.

Should I list Cadence Innovus, Synopsys ICC2, and Calibre if I've used all three?

Lead with whichever EDA flow the role uses. Hiring managers verify the headline tool first, so it has to show up in the profile summary, in the skills row, and in your strongest bullets. Add the other two only when there's real backing behind each (an Innovus block you closed, an ICC2 hierarchical design you owned, a Calibre signoff you defended). Three EDA tools with nothing behind them comes off as a checklist and gets read that way.

How long should my profile summary be?

Target five bullets, treat six as the hard cap. A paragraph asks a hiring manager to read carefully inside a window that exists only for scanning, which never happens on a first pass. As bullets, they pattern-match you against the process node, the chip class, and the EDA flow in under a second and decide whether the page deserves more attention.

Who wrote this

Built by an ex-Google recruiter

Emmanuel Gendre

Former Google recruiter · 12 years · 1,500+ tech resumes rewritten

I screen ASIC engineer resumes the same way I did at Google: against the role profile, against the JD, and against the bar real hiring managers set. Everything in this guide is the field manual I use with my own clients.

Read my full story →

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